When the cold wave is coming, in addition to daily maintenance, many customers need to know these things when using the equipment:
Problem 1: Poor adhesion
In winter, the temperature is low. When the day and night ambient temperature is lower than 0°C, the bonding strength will be affected. The board must be preheated before the edge is glued. The lower ambient temperature absorbs part of the heat of the hot melt adhesive and shortens the open time of the hot melt adhesive. A layer of film will be formed on the surface of the hot melt adhesive, causing false adhesion or poor adhesion. In this regard, the following countermeasures can be taken during the edge banding operation:

1. Warm up.
The ambient temperature affects the bonding strength, and the board must be preheated before the edge of the board is glued, especially in winter. Before the edge banding operation, the plates should be placed in the workshop in advance to keep the plate temperature the same as the workshop temperature.
2. Warm up.
On the basis of the original set temperature, the temperature of the hot melt glue tank can be increased by 5-8℃, and the temperature of the rubber coating wheel can be increased by 8-10℃.
3. Adjust the pressure.
If the pressure is low during edge sealing in winter, it is easy to cause an air gap between the hot melt adhesive and the substrate, which prevents the hot melt adhesive from infiltrating and mechanically occluding the substrate, resulting in false adhesion and poor adhesion. To solve this problem, check the sensitivity of the pressure wheel, the accuracy of the display instrument, the stability of the air supply system, and adjust the appropriate pressure.
4. Speed up.
Properly increase the sealing speed to avoid the hot melt adhesive being exposed to the cold air for too long.

Problem two: edge collapse and degumming
Both hot melt adhesive and edge banding are greatly affected by temperature. The lower the temperature, the more likely to be cold shrinkage, which will further harden as the temperature decreases and generate internal stress at the bonding interface. When the impact force of the grooving tool acts on the bonding interface, the internal stress is released, causing chipping or degumming.
To deal with this problem, we can start from the following points:
1. The temperature of the plate during grooving can be adjusted to above 18°C, so that the soft elastic hot melt adhesive can relieve the impact of the tool;
2. Change the direction of rotation of the tool to make the impact force of the tool act on the surface of the edge banding strip;
3. Reduce the grooving advance speed and grind the grooving tool frequently to reduce the impact force of the tool.

Problem three: "drawing"
In winter, the temperature difference between indoor and outdoor air temperature is large, and air convection will change the temperature environment, which is more prone to "drawing" problems (when sealing with transparent glue). In addition, if the temperature is too high (low), or the amount of glue applied is too large, there may be "drawing". It is recommended to adjust the temperature according to the temperature and the condition of the machine.